Low Temperature Co-fired Ceramic

Low Temperature Co-Fired Ceramic Technology refers to the process of mechanically punching holes, filling them with conductor paste, printing, packaging, and other processes used to produce the necessary electronic components from raw ceramic strips. As a cutting-edge technology, LTCC has a very broad application market and significant future development opportunities. It is mainly applied in various fields, such as computer science, automotive industry, medical sector and aerospace.

The development direction of LTCC is to create new types of ceramic tape systems with lower costs, higher performance and accuracy. These ceramic tape systems enable to produce electronic devices with high and low-frequency mixing, complex cavities, high-density integration, and miniaturization.

Punching → Filling → Printing → Stacking → Pressing → Hot Cutting → Co-Fired → Scribing→Testing

1,Test Items： Appearance
Test Tools ： Stereomicroscope
Test Methods： GJB548B Method 2032
Technical Index：80% of the graphic parts are complete

2,Test Items ：Overall Dimension
Test Tools：Vernier Caliper, Image Measuring Instrument
Test Methods ：GJB548B,Method 2016
Technical Index：

3,Test Items： Membrane Adhesion
Test Tools：3M610 Adhesive Tape
Test Methods： ASTM B571-97 Tape Testing Method
Technical Index ： Under a 40X microscope, there is no peeling phenomenon on the membrane layer in any form

4,Test Items：High Temperature Resistance of the Membrane Layer
Test Tools： Hot Stage
Test Methods ：Keep at 400 ℃ for 10 Minutes
Technical Index：Under a 40X microscope, there is no discoloration, peeling, blistering, or peeling phenomenon on the membrane layer in any form

5,Other Technical Indexes

The Microcircuit Center was established in 2022, with independent research and external cooperation functions. Industry experts lead the team to be responsible for related technical research and development work. The department has a purification plant of 1500 square meters and a technology research and development team of more than ten people, with industry-leading technical capabilities. The microcircuit center is built with LTCC (Low Temperature Co fired Ceramic)Ceramic production line, punching, printing, laminating, laminating, co firing, cutting and other related work. At the same time, there is also a thin film production line with complete processes such as sputtering, photolithography, and electroplating, which can undertake conventional thin film circuit products and DPC products.

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