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Luoyang Zhongchao New Material Co., Ltd. (hereinafter referred to "ZC-TECH") is located in Industrial Cluster Zone, Henan Province, China, covering an area of more than 60 acres. Founded in 2003, it is an enterprise that integrates professional research and development, production, and sales of environmentally friendly and pollution-free new material. Its main products are aluminum based super fine flame-retardant material and magnesium based super fine flame-retardant material, special alumina, spherical alumina, boehmite, advanced ceramics, electronic ceramics and other inorganic material.

Why Choose Us?

Advanced equipment

We use advanced equipment such as ICP-OES, SEM, thermal analyzers, BET testers, and laser particle size analyzers. These tools help keep product purity, particle size, and stability under strict control.

Complete service system from pre-sale to after-sale

We offer technical advice, free samples, test reports, and custom solutions before the order. During sales, we provide clear order management, real-time tracking, and batch quality reports. After delivery, we give fast support, problem resolution, and long-term communication.

Customization

Product selection: Recommend suitable models based on customer needs.
Provide customized formula designs for special requirements such as high filling, low smoke, and halogen-free applications.

Advantages of Low Temperature Co-fired Ceramic

Ceramic materials have excellent high frequency, high speed transmission and wide pass band characteristics.according to different ingredients, the dielectric constant of ltcc material can vary in a wide range. In combination with the use of metal material with high conductivity as the conductor material, it is beneficial to improve the quality factor of the circuit system and increase the flexibility of circuit design.

It can adapt to the requirements of high current and high temperature resistance, and has better thermal conductivity than ordinary pcb subgrade board, greatly optimizing the heat dissipation design of electronic equipment, high reliability, can be applied in harsh environment, extend its service life;

The electric subgrade board with a high number of layers can be made and multiple passive components can be embedded in it, which eliminates the cost of packaging components. In the three-dimensional electric subgrade board with a high number of layers, the integration of passive and active components can be realized, which is conducive to improving the assembly density of the circuit and further reducing the volume and weight.

It is compatible with other multilayer cabling technologies, such as ltcc combined with thin-film cabling technology to achieve higher assembly density and better performance of hybrid multilayer substrates and hybrid multichip components;

The discontinuous production technology facilitates the quality inspection of each layer wiring and interconnect through hole before the finished product is made, which is beneficial to improve the yield and quality of multilayer substrate, shorten the production cycle and reduce the cost.

Application of Low Temperature Co-fired Ceramic

Telecommunications:

Used in RF modules and antennas, LTCC enables high-frequency signal transmission with minimal loss, improving wireless communication quality.

Aerospace & defense:

Provides reliable, lightweight components for radar systems, satellite communications, and military electronics that must withstand harsh environments.

Medical devices:

Facilitates miniaturized imaging equipment, implantable devices, and portable diagnostic tools with integrated electronics.

Automotive:

Powers advanced driver-assistance systems (ADAS), sensors, and in-car communication modules, enhancing safety and connectivity.

Consumer electronics:

Supports smartphones, wearables, and IoT devices requiring compact, high-frequency circuits.

Product parameter

Item	Technical Index
Through Hole Diameter	0.2 mm,0.15 mm
Punching Position Accuracy	±10 µm
Stacking Accuracy	±10 µm
Printing The Thinnest Line Width	75 µm
Film Thickness Accuracy	±2 µm
Bond Strength	＞3 g(25 µm Diameter Golden thread)
Film Adhesion	＞0.5 kg/mm2
Number Of Layers	5~30 Layers

Advantages of Thin Film Circuit Technology

Miniaturization:

Thin-film technology allows the creation of highly compact circuits, making it suitable for applications where space is limited.

High frequency:

Thin-film circuits exhibit good performance at high frequencies, making them suitable for applications in RF and microwave systems.

High performance:

The use of high-quality materials and precise manufacturing processes results in circuits with excellent performance characteristics.

Low power consumption:

Thin-film circuits often have lower power consumption compared to other circuit technologies.

Reliability:

The thin-film manufacturing process ensures good adhesion and stability of materials, leading to improved reliability and longevity of the circuits.

Applications of Thin Film Circuit Technology

Optoelectronics and displays:
Thin-film coatings enable the creation of transparent conductive layers, anti-reflective coatings, and light-emitting layers, enhancing the performance and visual quality of optoelectronic devices.

Semiconductors and integrated circuits:
Thin-film technology plays a crucial role in the production of semiconductors and integrated circuits (ICs). It enables the deposition of thin layers of materials, such as silicon dioxide (SiO2) or silicon nitride (Si3N4), as insulating layers or gate dielectrics. Thin films also facilitate the creation of conductive pathways, interconnects, and metalization layers in IC fabrication processes.

Optics and photonics:
Thin films are extensively used in optical components and systems. They enable the production of anti-reflective coatings on lenses and mirrors to minimize light reflection and maximize light transmission.

Sensors and biosensors:
Thin-film technology finds applications in the development of sensors and biosensors for a wide range of industries. Thin films can be used to create sensitive layers that interact with target analytes or environmental conditions, enabling the detection of physical, chemical, or biological parameters.

Energy storage and conversion:
Thin films play a vital role in energy storage and conversion technologies. In batteries and fuel cells, thin films are used as protective coatings, separator materials, and catalyst layers to enhance performance, durability, and efficiency. Thin-film solar cells, such as thin-film photovoltaics (TFPV) based on materials like amorphous silicon (a-Si) or cadmium telluride (CdTe), offer an alternative to traditional silicon-based solar cells.

Microelectromechanical systems (MEMS):
Thin-film technology is integral to the fabrication of MEMS devices. Thin films are used to form structural layers, piezoelectric materials, and conductive traces in MEMS fabrication, enabling precise control and manipulation of physical phenomena at the microscale.

Product parameter

Item	Technical Index
Minimum Diameter of Metallized Through Hole	Substrate Thickness×0.8
The Minimum Distance from the Guide Band to the Edge of the Ceramic	0.050 mm
Lithographic Minimum Line Width	0.015mm
Resistance	±10%

Certificate

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fAQ

Q: What is a thin film circuit?

A: Thin film circuits are defined as electronic circuits created on a substrate by depositing a thin layer of metal, which is patterned using photolithography and selective etching, and are typically assembled in hermetic packages for protection.

Q: What is thin film technology?

A: Thin film technology involves depositing extremely thin layers of material onto a substrate to alter or enhance its properties for specific applications. These layers, often measured in nanometers or micrometers, can improve characteristics like electrical conductivity, optical properties, corrosion resistance, and wear resistance. Common applications include microchips, anti-reflective coatings on lenses, and protective layers on jewelry, medical devices, and solar cells.

Q: What is the difference between thick and thin film technology?

A: These techniques involve depositing layers of conductive and insulating materials onto a substrate to create the necessary circuitry. Thin film ICs utilize thin layers of materials, typically metal, while thick film ICs employ thicker layers of materials, often a combination of metals and ceramics.

Q: What is low temperature co-fired ceramics?

A: Low temperature co-fired ceramic (LTCC) is defined as a microelectronic technology used for the fabrication of multilayer ceramic boards, enabling the integration of various processes and the production of 3D mechanical structures for electronic devices.

Q: What is the difference between LTCC and HTCC?

A: LTCC technology enables the integration of passive components into compact modules, ideal for RF and microwave applications. HTCC is preferred for high-power applications, offering high thermal conductivity and structural strength that can withstand operating temperatures up to 1000°C.

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electronic materials and microcircuits, Low Temperature Co fired Ceramic, Thin Film Circuit Technology